Motorola AT Commands G24-LC Información técnica descargar pdf (Pagina 104)

Soldering Re-flow

80 G30 - Module Hardware Description December 15, 2009

RF Recommendation

Note: The restrictions below are valid for both U.FL connector and RF PAD.

• Avoid ANY routing below RF Test-Point Round circle, and RF pad, Pin-66.

• Keep the RF TP area and its clearance area cleared from Routing and GND (internal layers

also), at least 0.45mm below the G30.

• RF PAD must be connected with a 50 ohm controlled impedance Line.

• Keep the RF PAD area cleared from GND (internal layers also), at least 0.45mm below the

G30.

• Cover all Pads area with inner GND Layer below the 0.45mm routing clearance.

Soldering Re-flow

G30 LGA recommended soldering re-flow condition are max 237 C for 5 second duration.

Note: Any G30 LGA removal must be performed according to IPC-7711 standard "Rework of

Electronic Assemblies" chap 3.9.1 or 3.9.2 regarding “BGA/CSP Removal”. The

IPC-7711 can be found at www.ipc.org.

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Motorola AT Commands G24-LC Información técnica Pagina 104